Background
As operational landscapes grow more complex and dynamic, the need for agile, high-performance communication infrastructure has become a mission-critical priority. TERASi, a pioneer in mission-critical wireless systems, addresses this demand with a high-frequency communication solution built for extreme environments. At the core of its innovation is the TERASi’s AirCore™ platform, which leverages System-in-Package (SiP) technology to deliver robust performance within a compact, lightweight footprint.
The Challenge
The advanced level of miniaturization required by TERASi’s design introduced a new set of challenges. As component feature sizes approached micron scales, conventional inspection tools were no longer sufficient to reliably visualize or validate the internal structures of SiP assemblies. This posed a significant challenge for quality assurance, where accurate inspection of fully assembled modules is critical to ensuring performance, reliability, and compliance in mission-critical applications.
The Solution
To overcome these inspection challenges, TERASi integrates advanced, extreme-resolution X-ray imaging into its quality assurance workflow, enabling full internal visualization of SiP assemblies. Through this capability, TERASi achieves:
Sub-micron imaging precision that allows engineers to analyze intricate microstructures and verify the internal structures of SiP assemblies.
High inspection performance, ensuring rapid, reliable evaluation of production samples without slowing down development cycles.
Comprehensive material penetration, enabling visibility through metal-coated layers of RF components.
Powered by world-leading X-ray technology from Excillum, the non-destructive imaging capability allowed TERASi to inspect internal component structures with unprecedented clarity and speed, improving confidence in both prototyping and production.
Results
TERASi’s stringent standards for quality and reliability resulted in measurable improvements across development and manufacturing pipeline:
Increased Efficiency: Early detection of internal defects minimizes wasted resources
Accelerated Development: High-resolution visual feedback enabled faster design iterations during prototyping
Enhanced Reliability: Verified accuracy of RF components, improved the confidence for field deployment.
Conclusion
By reinforcing inspection accuracy and engineering precision, TERASi continues building the invisible infrastructure that underpins modern mission-critical connectivity in extreme and unpredictable environments.
Background
As operational landscapes grow more complex and dynamic, the need for agile, high-performance communication infrastructure has become a mission-critical priority. TERASi, a pioneer in mission-critical wireless systems, addresses this demand with a high-frequency communication solution built for extreme environments. At the core of its innovation is the TERASi’s AirCore™ platform, which leverages System-in-Package (SiP) technology to deliver robust performance within a compact, lightweight footprint.
The Challenge
The advanced level of miniaturization required by TERASi’s design introduced a new set of challenges. As component feature sizes approached micron scales, conventional inspection tools were no longer sufficient to reliably visualize or validate the internal structures of SiP assemblies. This posed a significant challenge for quality assurance, where accurate inspection of fully assembled modules is critical to ensuring performance, reliability, and compliance in mission-critical applications.
The Solution
To overcome these inspection challenges, TERASi integrates advanced, extreme-resolution X-ray imaging into its quality assurance workflow, enabling full internal visualization of SiP assemblies. Through this capability, TERASi achieves:
Sub-micron imaging precision that allows engineers to analyze intricate microstructures and verify the internal structures of SiP assemblies.
High inspection performance, ensuring rapid, reliable evaluation of production samples without slowing down development cycles.
Comprehensive material penetration, enabling visibility through metal-coated layers of RF components.
Powered by world-leading X-ray technology from Excillum, the non-destructive imaging capability allowed TERASi to inspect internal component structures with unprecedented clarity and speed, improving confidence in both prototyping and production.
Results
TERASi’s stringent standards for quality and reliability resulted in measurable improvements across development and manufacturing pipeline:
Increased Efficiency: Early detection of internal defects minimizes wasted resources
Accelerated Development: High-resolution visual feedback enabled faster design iterations during prototyping
Enhanced Reliability: Verified accuracy of RF components, improved the confidence for field deployment.
Conclusion
By reinforcing inspection accuracy and engineering precision, TERASi continues building the invisible infrastructure that underpins modern mission-critical connectivity in extreme and unpredictable environments.